Appearance inspection, automatic taping device iSort
It is a semiconductor sorting device that extracts dies from dicing wafers and transfers them to tape/reels or trays while inspecting the dies.
This is a semiconductor sorting device that performs visual inspection of the 5th and 6th sides of diced wafers, and transfers them to taping, reels, or trays. It is difficult to visually inspect the dies after dicing, so an automatic machine inspects for scratches and debris, determines good and defective products, and facilitates the transfer. 【Features】 ● Compatible with 8”, 12”, and diced wafers/film frames (WLCSP, BGA, eWLB, QFN, etc.) ● Supports taping and JEDEC/waffle trays ● Throughput: pph 20K ● Inspection items: - Co-planarity inspection of dies/solder balls/bumps - 5-side inspection - Die size - Cut line edge inspection - Marking inspection - Scratch and foreign matter inspection
- Company：CCTECH Japan CCTECH Japan（株）- 日本法人
- Price：Other
